C-TECH是一家領(lǐng)先的制造和開發(fā)公司，自1997年成立以來，主要研發(fā)生產(chǎn)銷售SAW濾波器業(yè)務(wù)，至今已超過20年。C-TECH采用優(yōu)異的原料，先進(jìn)的技術(shù)設(shè)備生產(chǎn)，產(chǎn)品品質(zhì)和經(jīng)驗(yàn)絲毫不輸同行。C-TECH晶振正在開發(fā)一種半導(dǎo)體工藝，可以獨(dú)立完成制造和組裝。憑借積累的技術(shù)和知識(shí)，我們提供定制開發(fā)根據(jù)客戶要求的規(guī)格。
基于ISO 9001和ISO 14001的可靠性，聲表面波濾波器開發(fā)和生產(chǎn)本身就是生產(chǎn)CDMA / LTE / 5G移動(dòng)中繼、國(guó)防工業(yè)、基站、收音機(jī)、無線尋呼機(jī)、無線麥克風(fēng)、調(diào)頻、DMB、GPS、WiFi、高通、藍(lán)牙、IOT等正在被應(yīng)用到無線業(yè)務(wù)的各個(gè)領(lǐng)域。下面C-TECH對(duì)自己精心鉆研的產(chǎn)品SAWFILTER聲表面濾波器進(jìn)行詳細(xì)介紹。
聲表面波濾波器（表面聲波）是使用表面聲波控制信號(hào)頻率分量和相位分量，以消除相鄰信道信號(hào)，它是一個(gè)帶通濾波器（BPF），對(duì)接收信道信號(hào)進(jìn)行整形。
SAW濾波器的工作原理
當(dāng)梳狀電極(IDT)形成在壓電基板的兩側(cè)并且電信號(hào)施加到輸入端時(shí)，沿襯底表面?zhèn)鞑サ谋砻媛暡?SAW)由壓電效應(yīng)產(chǎn)生，并在輸出端轉(zhuǎn)換回電信號(hào)。這些SAW器件的頻率特性由IDT電極的幾何結(jié)構(gòu)決定。
SAW濾波器制造工藝
| Process | Equipment | Description |
|---|---|---|
| WAFER Cleaning | Wet Station Rinse & Drier | Process to remove foreign substances causing short circuit defects on the wafer surface before AI deposition and to increase adhesion between the wafer surface and AL |
| Sputtering | Sputter T/Profiler | Process for depositing AL on wafer surface to desired height |
| P.R Coating | Coater | Process for applying photo Resist on AL |
| Exposing | Aligner Stepper | First step process of pattern formation by irradiating UV on PR through MASK |
| Developing | Developer Scope | Process of removing UV irradiated PR for AL Etching after Exposing |
| Etching | Wet Station Rinse & Drier | Process of implementing the final pattern by removing the AL in each selected manner |
| Stripping | Wet Station Rinse & Drier | Process for removing PR that protects AL patterns |
| Auto Probing | Auto Prober Dry Oven | Process for determining good and bad products by measuring metod before puttiong the products divided into cells of the wafer into assembly |
Assembl
| Process | Equipment | Description |
|---|---|---|
| Absorber Coating | Screen Printer Dry Oven | Process of applying an absorber to each cell to improve the characteristics of the output to the measuring device |
| Dicing | Tape Mounter Dicing SAW Cleaner | Process of cutting each cell of the wafer based on the Dicing Line |
| Die Bonding | Die bonder Epoxy Dispenser UV,Dry Oven | Process of bonding base and chip by applying epoxy |
| Wire Bonding | Wire Bonder | The Process of connecting the terminal of the BASE and the PAD of the CHIP to transmit an electrical signal to the AL wire |
| Can Sealing | Spot Welder Seam Sealer Dry Oven | Welding Process using Lid & Cap to protect the chip |
| Marking | Laser Maker | Process of laser marking the product’s unique model name and data code |
| Testing | Network Analyzer | Process for final inspection of product defects |
| Q.C | Network Analyzer | Process of sampling and inspection of mixed or defective products |
| Packing | Tape & Reel | Q.C process for packaging completed products |
| Shipping | Shipment of all process and packaged products |
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